Solder Paste SA605-HI4/LH/QH/QN/YL Sn96.5%Ag3.0%Cu0.5%

* Ingredients: Sn (Tin), Ag (Silver), Cu (Copper)
* Features of the product：
1) Excellent printing stability
2) Excellent thermal stability
3) Good wettability
4) Halogen free and non-corrosive
5) Reliable electrical performance
* Used in computer motherboards, graphics cards, communication equipment, vehicle equipment, etc.
*Cautions in use：
1）Do not use this product for other purposes differently from soldering.
2）Recommended storing condition and quality guarantee period are 6 months(keep:1~ 10℃)
3） When its temperature is restored to room temperature, avoid too rapid heating. Keep it at room temperature and wait(＞2hr). Do not open sealing when it is cold。 When using, stir the solder paste for about 2-3 minutes to return the solder paste to its original state.